Monday, March 03, 2014: Defective surface mount components can be repaired by using soldering irons or a non-contact rework system. The latter is a better choice because SMD work with a soldering iron requires considerable skill, and in many cases is not feasible. There are essentially two non-contact soldering/desoldering methods— infrared soldering and soldering with hot gas. In the case of infrared soldering, the energy for heating up the solder joint is transmitted through long or short wave infrared electromagnetic radiation.
Today, with technological advancements, one system unifies all the essential process steps, offering manual and automatic soldering, desoldering and placement, requiring only minimal action from the operator. Let’s look at some of the latest launches in rework systems.
Model: Expert 10.6 series for rework and Expert MiniOven-04 for reballing, Brand: Martin, Manufacturer: Martin GmbH, Germany
In November 2013, Martin GmbH expanded the capabilities of the Expert 10.6 series of rework systems by developing a new process shuttle for flux dipping, solder paste printing of QFN components and for handling the smallest SMDs. This series facilitates the reliable and precise rework of BGA, CSP and QFN components, connectors and sockets. Innovative technologies such as advanced vision placement, hybrid heating technology and the intuitively operated ‘easy solder’ software ensure safe soldering and desoldering without the intervention of operators in the soldering process.
Key features
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Desoldering, advanced vision placement
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Soldering, clean pad, dispensing
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Under heater (hybrid): 600 W – 3000 W
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Top heating (hot air): 300 W
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PCB size (max): 305 mm×305 mm
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Heated area: 275 mm×245 mm
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Field of view (min): 18 mm×14 mm
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Field of view (max): 85 mm×65 mm
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Placement accuracy: ± 0.015 mm
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Footprint: 865 mm×460 mm
Contact details: Felix Frischkorn, CEO, Ph: 491733955516, [email protected], www.martin-smt.de
India distributor: Bergen Systems Pvt Ltd
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Model: HCT2-120 digital hot air pencil, Brand: Metcal, Manufacturer: OK International, USA
Launched in November 2013, this hot air pencil, which is a handheld convection tool, is ideally suited for applications that use smaller components and integrated circuits. As component miniaturisation continues, the ergonomics of a pencil allow a user more freedom to access and rework components on the board, without affecting the adjacent parts.
Key features
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The hand piece has a slim and ergonomic design that feels like a pencil, with a rubber grip. Six nozzles
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(1.5 mm–4.0 mm) are included in the unit, with a nozzle plate holder inside the work stand
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A universal power supply senses the input line voltage and adjusts itself accordingly, which allows operation without adaptors or a change in performance
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The 120 watt ceramic heater and dual stage air pump provides the power and performance needed to deliver the correct amount of thermal energy. Additionally, a microprocessor controlled, closed-loop feedback system provides fast heating
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When the hand-piece is placed into the work stand, the temperature drops, prolonging heater life. This reduces electricity consumption
Contact details: Nathalie Morin, marketing communications manager, Ph: +1-714-799-9910, [email protected], www.metcal.com
India distributors: Mektronics, Maxim SMT Technologies Pvt Ltd, MEL Systems
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Model: ONYX 21, Brand: ZEVAC, Manufacturer: ZEVAC AG, Switzerland
Upgraded in October 2013, ONYX 21 has been designed according to the application requirements of a compact machine, which doesn’t compromise on functionality. It offers force measurement, strong top and bottom heating, nitrogen connection and modularity as a standard. The pre-heater offers powerful 3500 W for bottom heating and 2000 W for top heating.
Key features
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Motorised Vision and Z-axis, closed loop motion control
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Compact, stable design for smaller boards, but also capable of handling boards of up to 300×400 mm
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2000 W top side heater; 3500 W, 300×300 mm bottom side pre-heating
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The board cooling option has the benefit of lead-free soldering and faster process times
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Option for external site solder removal system for redressing after removal of component
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Closed loop airflow control
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Standard gas nozzles
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Four thermocouple ports to control process temperatures
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Closed loop force control for automatic picking, fluxing, placing and removing
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Max board size: 300 mm depth, 400 mm width; Max board thickness: 6 mm
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Max component size: SFOV 25×18.5 mm (standard); MFOV 70×70 mm (optional)
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Max component height: 20 mm bottom side; 30 mm top side
Contact details: Urs Ackermann, Ph: +41-0-326262086, [email protected], www.zevac.ch
India distributor: NMTronics India Pvt Ltd
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Model: IR-E6 Evolution 3000 BGA rework system, Brand: PDR, Manufacturer: PDR, UK
Upgraded in September 2013, the IR-E6 BGA/SMT rework system that uses PDR’s patented focused IR technology has been specially designed to cope with the challenges of repairing today’s large PCB assemblies. The system is tool-free, gas-free, instantly/precisely controllable, clean, modular, upgradeable and produces 100 per cent yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flip chips, etc, and is ready for 0201 and lead-free applications.
Key features
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Focused IR component heating
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IR enables the precise targeting of the component to be heated, so that adjacent components are not affected
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The passive nature of infrared heat also significantly reduces the risk of damaging the component or the PCB as compared to hot gas systems
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Low cost of ownership
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High build quality and no expensive nozzles. Has focus hoods or shields that can be purchased and replaced on a regular basis, hence results in near-zero follow-on costs
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User-friendly software that allows even inexperienced operators to quickly achieve good results
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Provides accurate, non-contact component temperature sensing and can automatically create and store thermal profiles for different assemblies, including for lead-free processes
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Uses a lens and iris that can be adjusted to any shape or size of component, simplifying the soldering/desoldering process for the operator
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Creates a red ‘comfort’ light that defines the area being reworked
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Modular and upgradeable system
Contact details: Frederic Renard, international sales manager, Ph: +33-6-30248953, [email protected], www.pdr-rework.com
India distributor: DVS India Pvt Ltd
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Model: Scorpion APR-1200-SRS advanced package rework system, Brand: Metcal, Manufacturer: OK International, UK
Last upgraded in April-2013, the Scorpion advanced package rework system ensures both accurate component placement and custom-tailored reflow profiles in a single platform rework system. It redefines precision and addresses the technical demands presented by component manufacturers today. It offers quick, accurate placement through the use of a new vision system that employs dual image overlay technology.
Key features
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LED lighting for top and bottom for shadow-free component visualisation and alignment
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Two-head modular design allows it to be tailored as per users’ specific rework needs and allows precision alignment of the smallest BGAs, QFNs and micro SMDs with the highest accuracy
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The open-ended board holder fits a wide variety of large, small and odd-shaped boards, allows precise positioning over the dual sub-zone preheater
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The standard auto-profile mode ensures fast and easy profile creation with a minimum of setting up time
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Source temperatures and time intervals can be modified on-the-fly, eliminating the need to wait for the current profile to terminate before modifications can be made
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Precise solder joint temperatures are measured and displayed on a real time graphical display. This provides the necessary data to accurately and easily establish the optimum reflow profile for each application
Contact details: Dilip Rane, regional sales manager, SE Asia, Ph: +91-9762452474, [email protected], www.metcal.com
India distributor: Maxim SMT Technologies Pvt Ltd
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Model: SRT Micra, Brand: SRT Micra, Manufacturer: VJ Electronix, USA
In January 2013, SRT Micra, a high throughput rework system, was upgraded with 30.5 cm×35.5 cm (14”×12”) board capability. Its new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, Micra addresses the challenges of reworking technologies such as PoP, QFN and micro-passive like 01005, 0.3 mm pitch CSP and RF shields. SRT Micra provides rapid RF shield removal that minimises thermal migration to sensitive components beneath. Micro-scavenging removes residual solder from the largest asymmetrical RF shield’s land to the smallest, tightly spaced micro-passive pads. The Micra hosts the ultra-flexible SierraMateV9 rework software, providing a new icon-driven user interface and SRT’s new AutoRun automatic process set-up. V9 further simplifies process definition and assures consistent, repeatable results while minimising training and profiling.
Key features
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High throughput rework/heating capability
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Focused convection top site heating
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Focused convection bottom site heating
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Optional bottom area heating
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Precise placement capability: 0.3 mm pitch process capability; 01005 rework capability; high resolution vision system; optional side view vision system
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New icon-driven user interface
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Fixed head with movable X-Y table
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Component range: 01005 to >50 mm
Contact details: Raymond Lafleur, regional sales manager, [email protected], Ph: +66-861060914, www.vjt.com
India distributor: TransTechnology India Pvt Ltd, www.trans-tec.com
For details, refer to advertisement in this issue. See Ad Index on page 8.
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